• AmberTec™ UP6040 H/OH Mixed Bed Ion Exchange Resin for Ultra-Pure Water with 18 MΩ*cm Resistivity and Low TOC Contribution
  • AmberTec™ UP6040 H/OH Mixed Bed Ion Exchange Resin for Ultra-Pure Water with 18 MΩ*cm Resistivity and Low TOC Contribution
  • AmberTec™ UP6040 H/OH Mixed Bed Ion Exchange Resin for Ultra-Pure Water with 18 MΩ*cm Resistivity and Low TOC Contribution
AmberTec™ UP6040 H/OH Mixed Bed Ion Exchange Resin for Ultra-Pure Water with 18 MΩ*cm Resistivity and Low TOC Contribution

AmberTec™ UP6040 H/OH Mixed Bed Ion Exchange Resin for Ultra-Pure Water with 18 MΩ*cm Resistivity and Low TOC Contribution

Product Details:

Place of Origin: China
Brand Name: Dupont
Certification: ISO 9001
Model Number: DuPont™ AmberTec™ UP6040 H/OH

Payment & Shipping Terms:

Minimum Order Quantity: 1 Set
Price: Negotiable
Packaging Details: Standard Export Wood Crate/Carton or Naked wrapped by film
Delivery Time: 7 work days
Payment Terms: T/T,Western Union,Paypal etc.
Supply Ability: 60000 Units per Month
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Detail Information

Copolymer: Styrene-divinylbenzene Matrix: Gel
Type: Strong Acid Cation Functional Group: Sulfonic Acid
Physical Form: Dark Amber, Translucent, Spherical Beads
Highlight:

18 MΩ*cm resistivity Mixed Bed Ion Exchange Resin

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Low TOC contribution Ultra-Pure Water Polishing Resin

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Strong Acid Cation Resin H/OH Ion Exchange Resin

Product Description

AmberTec™ UP6040 H/OH Mixed Bed Ion Exchange Resin – Ultra-Pure Water Final Polishing Media

The AmberTec™ UP6040 H/OH Mixed Bed Ion Exchange Resin is a premium-grade mixed bed deionization resin designed for final polishing applications in ultrapure water (UPW) treatment systems. Combining high-capacity strong acid cation resin in H⁺ form and strong base anion resin in OH⁻ form, this fully regenerated mixed bed resin provides exceptional ionic removal performance and helps achieve ultra-high resistivity water quality.

Designed for demanding industries requiring extremely clean water, AmberTec™ UP6040 H/OH delivers stable polishing performance with very low ionic leakage and controlled organic release. It is widely applied in semiconductor manufacturing, photovoltaic production, pharmaceutical water systems, laboratory purification, and power generation facilities.

The resin is optimized for use after reverse osmosis (RO), electrodeionization (EDI), or other deionization processes where final water quality improvement is required.

Key Advantages
Ultra-Pure Water Polishing Performance

Designed for final-stage purification:

  • Produces water quality up to: 18 MΩ·cm resistivity
  • Extremely low ionic leakage
  • Low TOC contribution
  • Suitable for critical UPW applications
High-Purity Mixed Bed Configuration

The resin system combines:

Strong Acid Cation Resin
  • Ionic form: H⁺
  • High exchange capacity
  • Efficient removal of positively charged ions
Strong Base Anion Resin
  • Ionic form: OH⁻
  • High purity hydroxide form
  • Effective removal of negatively charged ions

Together they provide continuous ion removal and high-quality polishing performance.

Typical Applications
Semiconductor & Electronics
  • Wafer cleaning water
  • Ultrapure process water
  • Microelectronics manufacturing
Solar Photovoltaic Industry
  • High-purity production water
  • Cell manufacturing processes
Pharmaceutical Applications
  • Purified water systems
  • Laboratory high-purity water
  • Critical process water treatment
Power Generation
  • Boiler feed water polishing
  • High-purity circulating water systems
Compatible System Designs
  • Mixed bed polishing vessels
  • Packed bed deionization systems
  • Replaceable resin cartridges
  • Portable exchange deionization systems
  • High-purity water circulation loops
Product Specifications
Property Cation Resin Anion Resin
Polymer Structure Styrene-DVB Styrene-DVB
Matrix Type Gel Gel
Functional Group Sulfonic Acid Trimethylammonium
Resin Type Strong Acid Cation Strong Base Anion Type I
Ionic Form H⁺ OH⁻
Total Exchange Capacity ≥2.00 eq/L ≥1.10 eq/L
Water Retention Capacity 45-51% 54-60%
Ionic Conversion ≥99% H⁺ ≥95% OH⁻
Particle Size Distribution
Parameter Cation Resin Anion Resin
Particle Diameter 525 ± 50 μm 630 ± 50 μm
Uniformity Coefficient ≤1.20 ≤1.20
Fine Particles ≤0.1% (<300 μm) --
Large Particles ≤5.0% (>850 μm) --
Performance Characteristics
Ultrapure Water Test Performance
Parameter Typical Value
UPW Rinse Resistivity (10 min) ≥18 MΩ·cm
Salt Challenge Resistivity (10 min) ≥18 MΩ·cm
ΔTOC After Rinse ≤3 ppb C
Recommended Operating Conditions
Parameter Range
Operating Temperature 15-25°C
Stable pH Range 0-14
Shipping Weight Approx. 710 g/L
Quality Assurance

Each production batch is evaluated through strict quality testing procedures including:

  • Resistivity rinse testing
  • TOC performance testing
  • Kinetic performance verification

This ensures consistent resin quality for demanding ultrapure water applications.

Safety & Handling Notes

Strong oxidizing chemicals may damage ion exchange resin materials under certain conditions. Proper chemical compatibility evaluation should be performed before operation.

Users should review relevant safety documentation and follow recommended handling procedures to ensure safe and reliable resin performance.

AmberTec™ UP6040 H/OH - Reliable Final Polishing Solution for Ultrapure Water

With high exchange efficiency, low organic release, and excellent polishing capability, AmberTec™ UP6040 H/OH provides a dependable solution for industries requiring stable and high-quality ultrapure water production.

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